多层基板金属线路制造方法及其结构

Manufacturing process for metal circuit of multi-layer substrate and construction thereof

Abstract

本发明揭示一种多层基板的金属线路制造方法及其结构。本发明的制造方法包含:在多层基板的介电层表面涂布光阻层并对该光阻层进行曝光,以定义金属线路的预定位置;去除位于预定位置的光阻层,在预定位置形成金属线路后,在金属线路的表面形成至少一层上包覆金属层。本发明能够仅通过一道光罩制程即在金属线路的上表面、侧表面,甚至底面形成一包覆金属层。本发明的金属线路制造方法及其结构,能制作更精细、可靠度更高的金属线路,也能制作可作为同轴导线应用的金属线路。
The invention discloses a metal circuit production method of a multilayer baseboard and a relative structure, wherein the method comprises: coating a light resistance layer on the surface of the dielectric layer of the multiplayer baseboard, exposing the light resistance layer to define a preset position of the metal circuit, deleting the light resistance layer at the preset position, forming a metal circuit on the preset position, forming at least one metal cover layer on the surface of the metal circuit. The invention only adopts a light mask process to form a metal cover layer on the upper surface, side surface and bottom of the metal circuit. The inventive metal circuit production method and structure can produce fine metal circuit with higher reliability and can product the metal circuit applied as a coaxial wire.

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    US-8373070-B2February 12, 2013Princo Middle East FzeMetal structure of flexible multi-layer substrate and manufacturing method thereof
    US-9398704-B2July 19, 2016Princo Middle East FzeManufacturing method of metal structure of flexible multi-layer substrate
    WO-2011047544-A1April 28, 2011巨擘科技股份有限公司Structure de couche métallique de carte flexible multicouche et son procédé de fabrication