用玻璃料密封的玻璃外壳及其制造方法

Glass package that is hermetically sealed with a frit and method of fabrication

Abstract

The invention describes a hermetically sealed glass package (100) and method (200) for manufacturing the hermetically sealed glass package (100) using an OLED display as an example. Basically, the hermetically sealed OLED display (100) is manufactured by providing a first substrate plate (102) and a second substrate plate (107) (step 202) and depositing a frit (106) onto the second substrate plate (107) (step 208). OLEDs (104) are deposited on the first substrate plate (102) (step 206). An irradiation source (110) (e.g., laser, infrared light) is then used to heat the frit (106) (step 212) which melts and forms a hermetic seal that connects the first substrate plate (102) to the second substrate plate (107) and also protects the OLEDs (104). The frit (106) is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source (110) heats the frit, it softens and forms a bond. This enables the frit (106) to melt and form the hermetic seal while avoiding thermal damage to the OLEDs (104).
本文中使用OLED显示器作为例子描述了一种密封的玻璃外壳(100)和制造该密封的玻璃外壳(100)的方法(200)。基本上,通过提供(步骤202)第一基板(102)和第二基板(107),并将玻璃料(106)沉积(步骤208)在第二基板(107)上,来制造密封的OLED显示器(100)。将OLED(104)沉积(步骤206)在第一基板(102)上。然后,用辐射源(110)(如激光、红外线)加热(步骤212)玻璃料(106),使其熔化形成将第一基板(102)连接到第二基板(107)上、并且也保护OLED(104)的封条(108)。所述玻璃料(106)是掺杂了至少一种过渡金属,并且还可能掺杂了CTE降低填料的玻璃,使得当辐射源(110)加热所述玻璃料时,其软化并形成粘结。这使得玻璃料(106)熔化形成封条(108),同时避免了对OLED(104)的热损坏。

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (21)

    Publication numberPublication dateAssigneeTitle
    CN-102666417-ASeptember 12, 2012浜松光子学株式会社玻璃熔接方法及玻璃层固定方法
    CN-102666417-BJanuary 21, 2015浜松光子学株式会社Glass welding method and glass layer fixing method
    CN-102666419-ASeptember 12, 2012浜松光子学株式会社玻璃熔接方法及玻璃层固定方法
    CN-102666419-BNovember 25, 2015浜松光子学株式会社玻璃熔接方法及玻璃层固定方法
    CN-102762511-AOctober 31, 2012浜松光子学株式会社玻璃熔接方法及玻璃层固定方法
    CN-102762511-BApril 15, 2015浜松光子学株式会社Glass welding method and glass layer fixing method
    CN-103078064-AMay 01, 2013四川虹视显示技术有限公司Organic light-emitting diode (OLED) panel packaging structure and packaging method
    CN-103078064-BSeptember 09, 2015四川虹视显示技术有限公司一种oled面板封装结构及封装方法
    CN-103102075-AMay 15, 2013京东方科技集团股份有限公司一种采用玻璃料进行密封的方法、装置及玻璃料
    CN-103102075-BMay 06, 2015京东方科技集团股份有限公司一种采用玻璃料进行密封的方法、装置及玻璃料
    CN-103490013-AJanuary 01, 2014上海大学Organic light-emitting diode packaging method and system
    CN-103490013-BApril 26, 2017上海大学有机发光二极管封装方法及系统
    US-9016091-B2April 28, 2015Hamamatsu Photonics K.K.Glass welding method and glass layer fixing method
    US-9021836-B2May 05, 2015Hamamatsu Photonics K.K.Glass welding method and glass layer fixing method
    US-9045365-B2June 02, 2015Hamamatsu Photonics K.K.Fusion-bonding process for glass
    US-9073778-B2July 07, 2015Hamamatsu Photonics K.K.Glass welding method
    US-9181126-B2November 10, 2015Hamamatsu Photonics K.K.Glass fusion method
    US-9227871-B2January 05, 2016Hamamatsu Photonics K.K.Glass welding method and glass layer fixing method
    US-9233872-B2January 12, 2016Hamamatsu Photonics K.K.Glass welding method and glass layer fixing method
    US-9236213-B2January 12, 2016Hamamatsu Photonics K.K.Glass welding method and glass layer fixing method
    US-9701582-B2July 11, 2017Hamamatsu Photonics K.K.Glass welding method and glass layer fixing method